Kingston Technology KVR16R11D4/16I

底架

Socket

引脚数

240

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1600

Chip Configuration

1Gx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

PC Type

PC3-12800

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

Number of Elements

36

RoHS

Compliant

零件状态

Obsolete

最高工作温度

85 °C

最小工作温度

0 °C

引脚数量

240

工作电源电压

1.5 V

最大电源电压

1.575 V

最小电源电压

1.425 V

组织结构

2Gx72

最高频率

1.6 GHz

锁相环

有

自我刷新

无

模块类型

240RDIMM

RoHS状态

供应商未确认