Kingston Technology KVR21S15S8/4

ECCN (US)

EAR99

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Chip Configuration

512Mx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

CAS Latency

15

PC Type

PC4-2133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

Lead Shape

No Lead

RoHS

Non-Compliant

零件状态

Obsolete

引脚数量

260

组织结构

512Mx64

锁相环

无

自我刷新

有

模块类型

260SODIMM

RoHS状态

符合RoHS标准