Kingston Technology KVR24N17S8K2/16

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

8

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

Number of Ranks

Single

CAS Latency

17

PC Type

PC4-2400

SPD EEPROM Support

有

Supplier Package

DIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

1Gx64

自我刷新

有

模块类型

288DIMM

RoHS状态

符合RoHS标准