Kingston Technology KVR24S17S6/4

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

4

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2400

Chip Configuration

512Mx16

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

17

PCB changed

260

Package Width

2.45(Max)

Package Length

69.6

Package Height

30

Mounting

Socket

Supplier Package

SODIMM

SPD EEPROM Support

有

PC Type

PC4-2400

零件状态

LTB

引脚数量

260

组织结构

512Mx64

锁相环

无

自我刷新

有

模块类型

260SODIMM

RoHS状态

是,有豁免