Kingston Technology KVR26S19S8/8

工厂交货时间

4 Weeks, 2 Days

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

8

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

CAS Latency

19

PC Type

PC4-2666

SPD EEPROM Support

有

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

Pins

260

Package Description

,

Manufacturer Part Number

KVR26S19S8/8

Manufacturer

Kingston Technology Company

Part Life Cycle Code

接触制造商

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.69

零件状态

活跃

Reach合规守则

unknown

引脚数量

260

电压

1.2V

速度

2666MHz

组织结构

1Gx64

记忆密度

8

内存IC类型

DDR内存模块

电容量

8 GB

自我刷新

有

模块类型

260SODIMM

RoHS状态

符合RoHS标准