Kingston Technology KVR32S22D8/16

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

16

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

3200

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

CAS Latency

22

PC Type

PC4-3200

SPD EEPROM Support

有

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

Pins

260

零件状态

Obsolete

引脚数量

260

电压

1.2V

速度

3200MHz

组织结构

2Gx64

电容量

16 GB

自我刷新

有

模块类型

260SODIMM

RoHS状态

符合RoHS标准