Kingston Technology KVR333X64SC25/512

表面安装

NO

终端数量

200

ECCN (US)

EAR99

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

16

Chip Density (bit)

256M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

333

Chip Configuration

32Mx8

Chip Package Type

UBGA

Minimum Operating Supply Voltage (V)

2.25

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.75

Module Sides

Double

ECC Support

无

Number of Chip Banks

4

CAS Latency

2.5

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

31.75

Package Length

67.6

PCB changed

200

Lead Shape

No Lead

Package Style

微电子组件

Number of Words Code

64000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIMM200,24

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

KVR333X64SC25/512

Clock Frequency-Max (fCLK)

167 MHz

Number of Words

67108864 words

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Kingston Technology Company

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

8.61

零件状态

Obsolete

技术

CMOS

端子位置

DUAL

终端形式

无铅

端子间距

0.6 mm

Reach合规守则

unknown

引脚数量

200

JESD-30代码

R-PDMA-N200

资历状况

不合格

电源

2.5 V

温度等级

OTHER

组织结构

64Mx64

输出特性

3-STATE

内存宽度

64

记忆密度

4294967296 bit

锁相环

无

I/O类型

COMMON

内存IC类型

DDR内存模块

刷新周期

8192

自我刷新

无

模块类型

200SODIMM

RoHS状态

供应商未确认