Kingston Technology KVR667D2D8F5/1G

工厂交货时间

12 Weeks

ECCN (US)

EAR99

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

18

Chip Density (bit)

512M

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

64Mx8

Typical Operating Supply Voltage (V)

1.8

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

FBDIMM

Mounting

Socket

Package Height

30.35

Package Length

133.35

Package Width

8.8(Max)

PCB changed

240

Lead Shape

No Lead

Package Description

,

Manufacturer Part Number

KVR667D2D8F5/1G

Manufacturer

Kingston Technology Company

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.83

零件状态

Obsolete

Reach合规守则

unknown

引脚数量

240

组织结构

128Mx72

记忆密度

1

锁相环

有

自我刷新

无

模块类型

240FBDIMM

RoHS状态

是,有豁免