Kingston Technology KVR667D2D8F5/2GI

表面安装

NO

终端数量

240

ECCN (US)

EAR99

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

18

Chip Density (bit)

1G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.8

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

FBDIMM

Mounting

Socket

Package Height

30.35

Package Length

133.35

Package Width

8.8(Max)

PCB changed

240

Lead Shape

No Lead

Package Description

DIMM,

Package Style

微电子组件

Number of Words Code

256000000

Package Body Material

UNSPECIFIED

Operating Temperature-Max

95 °C

Manufacturer Part Number

KVR667D2D8F5/2GI

Number of Words

268435456 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Kingston Technology Company

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.84

零件状态

Obsolete

附加功能

AUTO REFRESH; SEATED HGT-NOM; WD-MAX

技术

CMOS

端子位置

DUAL

终端形式

无铅

功能数量

1

Reach合规守则

unknown

引脚数量

240

JESD-30代码

R-XDMA-N240

温度等级

OTHER

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

256Mx72

座位高度-最大

30.35 mm

内存宽度

72

记忆密度

19327352832 bit

锁相环

有

内存IC类型

DDR内存模块

访问模式

双库页面突发

自我刷新

无

模块类型

240FBDIMM

宽度

8.8 mm

长度

133.35 mm

RoHS状态

符合RoHS标准