Kingston Technology KVR667D2N5/1G

ECCN (US)

EAR99

HTS

8542.32.00.32

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

8

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Module Sides

Single

ECC Support

无

CAS Latency

5

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

18.3

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

128Mx64

锁相环

无

自我刷新

无

模块类型

240DIMM

RoHS状态

是,有豁免