Kingston Technology KVR667D2N5/2G

ECCN (US)

EAR99

HTS

8473.30.20.00

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

16

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Module Sides

Double

ECC Support

无

CAS Latency

5

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4

PCB changed

240

Lead Shape

No Lead

Package Description

,

Manufacturer Part Number

KVR667D2N5/2G

Risk Rank

5.84

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Part Life Cycle Code

Obsolete

Manufacturer

Kingston Technology Company

零件状态

Obsolete

Reach合规守则

unknown

引脚数量

240

组织结构

256Mx64

锁相环

无

模块类型

240DIMM

RoHS状态

是,有豁免