Micron Technology Inc PF38F5070M0Y0V0

表面安装

YES

终端数量

165

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

FBGA, BGA165,12X15,25

Access Time-Max

96 ns

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA165,12X15,25

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B165

资历状况

不合格

待机电流-最大值

0.00016 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM