Micron Technology Inc RD38F3352LLZDQ0

表面安装

YES

终端数量

88

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

FBGA, BGA88,8X12,32

Access Time-Max

88 ns

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA88,8X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B88

资历状况

不合格

电源电流-最大值

0.035 mA

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM