NXP Semiconductors BLS6G2731-6

ECCN (US)

EAR99

Channel Mode

Enhancement

Number of Elements per Chip

1

Process Technology

LDMOS

PCB changed

3

Package Width

6.93(Max)

Package Length

6.93(Max)

Package Height

3.63(Max)

Mounting

表面贴装

Supplier Package

CDFM

AEC Qualified

Unknown

Maximum Operating Temperature (°C)

200

Minimum Operating Temperature (°C)

-65

Typical Drain Efficiency (%)

33

Minimum Frequency (MHz)

2700

Maximum Frequency (MHz)

3100

Typical Power Gain (dB)

15

Output Power (W)

6

Typical Forward Transconductance (S)

0.81(Min)

Maximum Drain Source Resistance (mOhm)

[email protected]

Maximum Continuous Drain Current (A)

3.5

Maximum VSWR

5

Maximum Gate Source Voltage (V)

13

Maximum Drain Source Voltage (V)

60

零件状态

Obsolete

引脚数量

3

配置

Single

信道型

N

操作方式

脉冲射频

RoHS状态

符合RoHS标准