NXP USA Inc. CBTL04082ABS

表面安装

YES

终端数量

42

Manufacturer Part Number

CBTL04082ABS

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFN

Package Description

3.5 X 9 MM, 0.85 MM PITCH, PLASTIC, HVQFN-42

Risk Rank

5.84

Moisture Sensitivity Levels

2

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

Reflow Temperature-Max (s)

30

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

Reach合规守则

unknown

引脚数量

42

JESD-30代码

R-PQCC-N42

资历状况

不合格

逻辑IC类型

MULTIPLEXER AND DEMUX/DECODER