Samsung Semiconductor K6X4008C1F-BF55T00

表面安装

YES

终端数量

32

Supplier Package

SOP

Standard Package Name

SOP

PCB changed

32

Package Length

20.47

Package Width

11.43

Package Height

2.74

Mounting

表面贴装

Supplier Temperature Grade

Industrial

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Operating Current (mA)

30

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

4.5

Process Technology

CMOS

Max. Access Time (ns)

55

Timing Type

Asynchronous

Address Bus Width (bit)

19

Data Rate Architecture

SDR

Number of Bits/Word (bit)

8

Number of Words

512K

Chip Density (bit)

4M

PPAP

无

Automotive

无

ECCN (US)

3A991.b.2.a

EU RoHS

Compliant

Lead Shape

Gull-wing

Package Description

SOP, SOP32,.56

Package Style

小概要

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP32,.56

Operating Temperature-Min

-40 °C

Access Time-Max

55 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

K6X4008C1F-BF55T00

Supply Voltage-Nom (Vsup)

5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.81

包装

卷带

零件状态

Obsolete

子类别

SRAMs

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

32

JESD-30代码

R-PDSO-G32

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

端口的数量

1

操作模式

ASYNCHRONOUS

电源电流-最大值

0.03 mA

组织结构

512KX8

输出特性

3-STATE

内存宽度

8

待机电流-最大值

0.000012 A

记忆密度

4194304 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM

待机电压-最小值

2 V