Samsung Semiconductor M393A1G40EB1-CRC

EU RoHS

Compliant

ECCN (US)

4A994.a

HTS

8473.30.11.40

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.175

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1769

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

16

CAS Latency

17

SPD EEPROM Support

无

Mounting

Socket

Package Height

31.25

Package Width

4.3(Max)

Package Length

133.35

PCB changed

288

Supplier Package

RDIMM

零件状态

活跃

引脚数量

288

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM