Samsung Semiconductor M471A1K43DB1-CTD

EU RoHS

Compliant

HTS

8473.30.11.40

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

8

Chip Density (bit)

8G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.17

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

16

CAS Latency

19

SPD EEPROM Support

无

Mounting

表面贴装

Package Height

0.73

Package Width

10.3

Package Length

11

PCB changed

78

Supplier Package

FBGA

零件状态

活跃

引脚数量

78

组织结构

1Gx64

锁相环

无

自我刷新

有

模块类型

260SODIMM