参数名
参数值
参数名
参数值
包装/外壳
DR
材料
Si
ECCN (US)
EAR99
HTS
8541.29.00.95
Channel Mode
Enhancement
Number of Elements per Chip
2
Process Technology
DMOS
Maximum Drain Source Voltage (V)
70
Maximum Gate Source Voltage (V)
±20
Maximum VSWR
20(Min)
Maximum Continuous Drain Current (A)
30
Typical Input Capacitance @ Vds (pF)
360(Max)@28V
Maximum Power Dissipation (mW)
438000
Output Power (W)
150
Typical Power Gain (dB)
13(Min)
Maximum Frequency (MHz)
200
Minimum Frequency (MHz)
1
Typical Drain Efficiency (%)
50(Min)
Maximum Operating Temperature (°C)
200
Supplier Package
DR型壳体
Military
无
Mounting
Screw
Package Height
5.08
Package Length
34.03
Package Width
22.22(Max)
PCB changed
5
Vds - Drain-Source Breakdown Voltage
70 V
Transistor Polarity
N-Channel
Maximum Operating Temperature
+ 150 C
Mounting Styles
SMD/SMT
Id - Continuous Drain Current
30 A
零件状态
活跃
技术
Si
引脚数量
5
工作频率
175 MHz
配置
双共源
输出功率
150 W
增益
13 dB
信道型
N
RoHS状态
符合RoHS标准