参数名
参数值
参数名
参数值
包装/外壳
SOIC-8
材料
Si
ECCN (US)
EAR99
HTS
8541.29.00.95
Number of Elements per Chip
2
Process Technology
DMOS
Maximum Drain Source Voltage (V)
65
Maximum Gate Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
5
Maximum VSWR
20
Maximum Continuous Drain Current (A)
2
Maximum Gate Source Leakage Current (nA)
1000
Maximum IDSS (uA)
2000
Typical Input Capacitance @ Vds (pF)
24(Max)@0V
Typical Reverse Transfer Capacitance @ Vds (pF)
1(Max)@28V
Typical Output Capacitance @ Vds (pF)
12(Max)@28V
Typical Forward Transconductance (S)
0.36(Min)
Maximum Power Dissipation (mW)
30000
Output Power (W)
5
Typical Power Gain (dB)
13(Min)
Maximum Frequency (MHz)
1000
Minimum Frequency (MHz)
1
Typical Drain Efficiency (%)
40(Min)
Minimum Operating Temperature (°C)
-65
Maximum Operating Temperature (°C)
200
Standard Package Name
SOP
Supplier Package
SO
Military
无
Mounting
表面贴装
Package Height
2.18
Package Length
5.08
Package Width
4.06
PCB changed
8
Lead Shape
Gull-wing
Vds - Drain-Source Breakdown Voltage
65 V
Transistor Polarity
N-Channel
Maximum Operating Temperature
+ 150 C
Mounting Styles
SMD/SMT
Id - Continuous Drain Current
2 A
零件状态
活跃
技术
Si
引脚数量
8
工作频率
1 GHz
配置
双四源
输出功率
5 W
增益
13 dB
RoHS状态
符合RoHS标准