N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

208

Non-Compliant

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

AGL125V5-FGG144I

108 MHz

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

97

Tray

AGL125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

13 mm

13 mm

N/A

-

表面贴装

Non-Compliant

无

AGL250V2-VQ100T

Microsemi Corporation

活跃

MICROSEMI CORP

5.79

36864

70 °C

0 °C

8542.39.00.01

unknown

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

174

Tray

A54SX32

Obsolete

0°C ~ 70°C (TA)

SX

3V ~ 3.6V, 4.75V ~ 5.25V

48000

2880

N/A

-

YES

208

FLATPACK, GUARD RING

3.63 V

3.3 V

2.97 V

Military grade

5962-9956903QYC

Obsolete

MICROSEMI CORP

GQFF,

5.81

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.16 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

29.21 mm

29.21 mm

N/A

-

YES

208

FLATPACK, GUARD RING

3.63 V

3.3 V

2.97 V

Military grade

5962-9956904QYC

Obsolete

MICROSEMI CORP

GQFF,

5.26

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.16 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

29.21 mm

29.21 mm

N/A

-

表面贴装

208-BFCQFP with Tie Bar

YES

208-CQFP (75x75)

208

微芯片技术

FLATPACK, GUARD RING

2.75 V

2.5 V

174

Tray

5962-0151802

活跃

2.25 V

Military grade

5962-0151802QYC

活跃

MICROSEMI CORP

GQFF,

5.22

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

-55°C ~ 125°C (TJ)

SX-A

e4

3A001.A.2.C

GOLD

2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION

8542.39.00.01

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

Qualified

MILITARY

32000 GATES

3.22 mm

现场可编程门阵列

48000

2880

MIL-PRF-38535 Class Q

32000

29.21 mm

29.21 mm

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

248

微芯片技术

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-FCV484I

FBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

无

M2GL150-1FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

90

IGLOO2

微芯片技术

1.26 V

169

Tray

M2GL005

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-VFG400I

LFBGA

SQUARE

活跃

IC FPGA 169 I/O 400VFBGA

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

6060

719872

STD

17 mm

17 mm

N/A

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

活跃

微芯片技术

M2GL150

Tray

293

16 X 16 MM, 0.50 MM PITCH, FBGA-536

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

M2GL150

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-1FCSG536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

IGLOO2

90

有

Details

293

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B536

现场可编程门阵列

146124

5120000

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

Tray

M2GL150

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150TS-1FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

293

0°C ~ 85°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

1

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

60

IGLOO2

267

微芯片技术

Tray

M2GL050

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

有

90

IGLOO2

微芯片技术

169

Tray

M2GL005

活跃

1.26 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005S-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

209

Tray

M2GL005

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL005S-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

209

不合格

1.2 V

87.9 kB

209

2.44 mm

现场可编程门阵列

6060

719872

6060

23 mm

23 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

84

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

Details

1.14 V

有

60

IGLOO2

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

IGLOO2

200

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

176

-40°C ~ 100°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

300

Tray

A3P1000

活跃

This product may require additional documentation to export from the United States.

Details

11000 LE

有

60

ProASIC3

-55°C ~ 125°C (TJ)

Tray

A3P1000

125 °C

-55 °C

1.425V ~ 1.575V

18 kB

147456

1e+06

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

60

IGLOO2

微芯片技术

1.26 V

84

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL005-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

0°C ~ 85°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

IGLOO2

267

微芯片技术

Tray

M2GL050

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

1.14 V

85 °C

无

M2GL050T-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

60

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

有

M2GL050TS-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

1

56340

17 mm

17 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

1.26 V

84

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL005S-TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

-40°C ~ 100°C (TJ)

Tray

M2GL005S

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

30

S-PQFP-G144

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm