品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 质量 | 终端数量 | 电阻材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 温度系数 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 功率(瓦特) | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | 终端样式 | JESD-30代码 | 功能 | 基本谐振器 | 最大电流源 | 输出的数量 | 资历状况 | 执行器类型 | 工作电源电压 | 电源 | 温度等级 | 电流 - 电源(禁用)(最大值) | 最大电源电压 | 最小电源电压 | 内存大小 | 反向泄漏电流@ Vr | 不同 If 时电压 - 正向 (Vf) | 传播延迟 | 接通延迟时间 | 功率 - 最大 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 电压 - 齐纳(标准值)(Vz) | 套管螺纹 | 调整类型 | 逻辑元件/单元数 | 产品类别 | 转弯数量 | 锥度 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 内置开关 | 收发器数量 | 绝对牵引范围 (APR) | 执行器直径 | 轮调 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 插座数量 | 电阻(欧姆) | 等效门数 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 执行器长度 | 辐射硬化 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||
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![]() | RT4G150L-CQG352B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 352-BFCQFP Exposed Pad | 352-QFP (48x48) | ITT Cannon, LLC | Bulk | KJB7T | 活跃 | -55°C ~ 125°C (TJ) | * | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | M2GL005S-FG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.28 | 209 | Tray | M2GL005 | 活跃 | 1.26 V | 1.14 V | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 20 | 85 °C | 无 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 209 | 不合格 | 1.2 V | OTHER | 209 | 2.44 mm | 现场可编程门阵列 | 6060 | 719872 | 6060 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300XT-1FCG784I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Non-Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | PEI-Genesis | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Bulk | 活跃 | 101 | A42MX09 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX09-PQ160 | 0°C ~ 70°C (TA) | * | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.5 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL100-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | PLASTIC | BGA1152,34X34,40 | 1.2 V | 有 | M2GL100-1FCG1152I | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.82 | 网格排列 | BGA, BGA1152,34X34,40 | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-2PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | 125 | Compliant | Tray | A42MX24 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-2PQ160 | 105 MHz | QFP | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9958501QYC/GROUPADATA | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Murata Electronics | Tape & Reel (TR) | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-FTQG64 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.6 | 46 | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 2.5 V | 40 | 2.3 V | 70 °C | 有 | EX128-FTQG64 | 178 MHz | 0°C ~ 70°C (TA) | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | COMMERCIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | F | 1.4 ns | 6000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-CQ256B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 256 | 10.567001 g | 256 | QFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | 5.26 | Military grade | 203 | Compliant | CERAMIC, QFP-256 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 3.3 V | 20 | 2.97 V | 125 °C | 无 | A54SX32-CQ256B | 205 MHz | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 246 | 不合格 | 5 V | 3.3,5 V | MILITARY | 5.5 V | 4.5 V | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 48000 | 205 MHz | MIL-STD-883 Class B | 2880 | 1080 | 1 ns | 2880 | 2880 | 32000 | 2.8 mm | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | PEI-Genesis | AFS250-1PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | Bulk | 活跃 | 93 | Compliant | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | * | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN020-QNG68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AC, SMA | YES | DO-214AC (SMA) | 68 | Micro Commercial Co | A3PN020-QNG68 | 有 | 70 °C | 1.425 V | 30 | 1.5 V | -20 °C | UNSPECIFIED | 3 | Bulk | SMAJ4757 | 95 Ohms | 活跃 | 49 | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5.25 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | HVQCCN | -65°C ~ 150°C (TJ) | Automotive, AEC-Q101 | ±5% | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | OTHER | 5 µA @ 38.8 V | 1.2 V @ 100 mA | 1 W | 520 CLBS, 20000 GATES | 1 mm | 现场可编程门阵列 | 51 V | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | 无 | 109 MHz | QFP | RECTANGULAR | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | 64676-5AD | Name Brand Replacements™ | 57 | Tray | A40MX02 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN250-Z1VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | Plastic,Fabric | 28g | 微芯片技术 | Tray | A3PN250 | Obsolete | LED (monochrome) | battery-powered | Purple,Green,Yellow | 68 | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 36864 | 250000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX1000-2BGG729I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 4-SMD, No Lead | YES | 729 | 729-PBGA (35x35) | 729 | 微芯片技术 | 有 | AX1000-2BGG729I | 870 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 516 | Tray | AX1000 | 活跃 | Compliant | BGA, BGA729,27X27,50 | 网格排列 | 3 | PLASTIC/EPOXY | BGA729,27X27,50 | -40 °C | 1.5 V | 40 | 1.425 V | 85 °C | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | e1 | 活跃 | XO (Standard) | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.8V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 33.3333MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B729 | Standby (Power Down) | MEMS | 31mA | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 10µA | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | -- | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 0.039 (1.00mm) | 35 mm | 35 mm | 无 | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-1FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 280 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 111 | Compliant | Tray | A54SX08 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX08-1FG144 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | e0 | 活跃 | XO (Standard) | 锡铅银 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.5V | BOTTOM | BALL | 225 | 1 mm | compliant | 3.57MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B144 | Standby (Power Down) | MEMS | 33mA | 111 | 不合格 | 5 V | 3.3,5 V | COMMERCIAL | 70µA | 5.25 V | 4.75 V | 800 ps | 800 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 768 | 1 | -- | 256 | 0.8 ns | 768 | 768 | 8000 | 1.05 mm | 0.032 (0.80mm) | 13 mm | 13 mm | 无 | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P1000-1FGG484T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 484-FPBGA (23x23) | 484 | 1.425 V | 微芯片技术 | 125 °C | 有 | A3P1000-1FGG484T | 350 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | Automotive grade | 300 | Tray | A3P1000 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -40 °C | 1.5 V | 30 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | e1 | 活跃 | XO (Standard) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3.3V | BOTTOM | BALL | 250 | 1 mm | compliant | 40.5MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B484 | Standby (Power Down) | MEMS | 33mA | 300 | 不合格 | 1.5/3.3 V | AUTOMOTIVE | 70µA | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 147456 | 1000000 | AEC-Q100 | 1 | -- | 24576 | 24576 | 1000000 | 0.032 (0.80mm) | 23 mm | 23 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08-2FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | 320 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 111 | Compliant | Tray | A54SX08 | 活跃 | 1 MM PITCH, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX08-2FG144 | -20°C ~ 70°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | e0 | 活跃 | XO (Standard) | 锡铅银 | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.8V | BOTTOM | BALL | 225 | 1 mm | compliant | 106.25MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B144 | Standby (Power Down) | MEMS | 33mA | 111 | 不合格 | 5 V | 3.3,5 V | COMMERCIAL | 10µA | 5.25 V | 4.75 V | 700 ps | 700 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 768 | 2 | -- | 256 | 0.7 ns | 768 | 768 | 8000 | 1.05 mm | 0.032 (0.80mm) | 13 mm | 13 mm | 无 | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS1500-2FG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 4-SMD, No Lead | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | 微芯片技术 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 252 | Tray | M1AFS1500 | 活跃 | Compliant | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS1500-2FG676I | BGA | SQUARE | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | e0 | 活跃 | XO (Standard) | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.5V | BOTTOM | BALL | 225 | 1 mm | compliant | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B676 | Enable/Disable | MEMS | 36mA | 不合格 | 1.5 V | INDUSTRIAL | 31mA | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 276480 | 1500000 | 1.47059 GHz | 2 | -- | 38400 | 38400 | 1500000 | 1.73 mm | 0.032 (0.80mm) | 27 mm | 27 mm | 无 | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 6-SMD, No Lead | 1152-FCBGA (35x35) | 微芯片技术 | Compliant | 574 | Tray | M2GL150 | 活跃 | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 85 °C | 0 °C | 3.3V | 155.52MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 1.2 V | 35mA | 625 kB | 146124 | 5120000 | STD | -- | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGL250V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 4-SMD, No Lead | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | 68 | Compliant | Tray | M1AGL250 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M1AGL250V2-VQG100 | 108 MHz | TFQFP | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | e3 | 活跃 | XO (Standard) | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 3.3V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 24.576MHz | ±10ppm | LVCMOS, LVTTL | S-PQFP-G100 | Standby (Power Down) | MEMS | 33mA | 不合格 | 1.5 V | OTHER | 70µA | 1.575 V | 1.14 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | STD | -- | 6144 | 250000 | 1 mm | 0.032 (0.80mm) | 14 mm | 14 mm | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.6 | 71 | Tray | AGL125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | AGL125V2-VQG100 | 108 MHz | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | e3 | 活跃 | XO (Standard) | Tin (Sn) | 8542.39.00.01 | CMOS | 2.8V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | 38.4MHz | ±10ppm | LVCMOS, LVTTL | S-PQFP-G100 | Enable/Disable | MEMS | 33mA | 不合格 | OTHER | 31mA | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | -- | 3072 | 125000 | 0.032 (0.80mm) | 14 mm | 14 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V2-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | Carbon | 71 I/O | + 100 C | 1.575 V | 0.309754 oz | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 微芯片技术 | 526.32 MHz, 892.86 MHz | IGLOOe | N | Tray | AGL125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 100 °C | 无 | AGL125V2-VQ100I | 108 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 1.73 | -- | 有 | 1500 LE | -40°C ~ 85°C (TA) | Bulk | RV4 | ±10% | e0 | 活跃 | -- | Tin/Lead (Sn/Pb) | 2W | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | 焊片 | S-PQFP-G100 | 不合格 | Slotted | 1.2 V to 1.5 V | INDUSTRIAL | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3/8-32 | 用户定义 | 3072 | FPGA - Field Programmable Gate Array | 1 | Linear | 36864 | 125000 | STD | None | - | 0.249 (6.32mm) | 314° | 3072 | 1 | 100 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | 0.625 (15.88mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250-2VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 100-TQFP | 100-VQFP (14x14) | Cermet | 微芯片技术 | ProASIC3 | N | -- | 68 | Tray | A3P250 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 3000 LE | + 100 C | 1.575 V | - 40 C | 90 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 310 MHz | -40°C ~ 100°C (TJ) | Bulk | RJ-6 | Round - 0.276 Dia x 0.228 H (7.00mm x 5.80mm) | ±10% | 活跃 | -- | ±100ppm/°C | 100 Ohms | 0.5W, 1/2W | 可编程逻辑集成电路 | 1.425V ~ 1.575V | PC引脚 | 1.5 V | - | 顶部调整 | FPGA - Field Programmable Gate Array | 1 | 36864 | 250000 | 2 | - | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P250-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | Cermet | + 85 C | 1.575 V | 1.092717 oz | 0 C | 24 | 1.425 V | SMD/SMT | Microchip | Microchip Technology / Atmel | 微芯片技术 | 350 MHz | ProASIC3 | Details | Tray | M1A3P250 | 活跃 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | M1A3P250-PQG208 | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | -- | 有 | 3000 LE | 151 I/O | 0°C ~ 85°C (TJ) | Bulk | RJ-6 | Round - 0.413 Dia x 0.299 H (10.50mm x 7.60mm) | ±10% | e3 | 活跃 | -- | ±100ppm/°C | 200 Ohms | Matte Tin (Sn) | 0.5W, 1/2W | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | PC引脚 | S-PQFP-G208 | 不合格 | 1.5 V | COMMERCIAL | - | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | Back Side Adjustment | FPGA - Field Programmable Gate Array | 1 | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL1000V5-FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | Carbon | 微芯片技术 | 5.26 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | LBGA | 108 MHz | -- | 97 | Tray | AGL1000 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AGL1000V5-FG144 | 0°C ~ 70°C (TA) | Bulk | RV4 | ±10% | e0 | 活跃 | -- | Tin/Lead/Silver (Sn/Pb/Ag) | 2W | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | 焊片 | S-PBGA-B144 | 不合格 | Slotted | OTHER | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 3/8-32 | 用户定义 | 24576 | 1 | Linear | 147456 | 1000000 | STD | None | 0.249 (6.32mm) | 314° | 24576 | 1 | 50k | 1000000 | 13 mm | 13 mm | 2.000 (50.80mm) |
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