N/A

-

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

Details

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

172 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

0°C ~ 70°C (TA)

Tray

A54SX32A

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (27X27)

400.011771 mg

微芯片技术

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

Details

360 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

217 MHz

有

40

-40°C ~ 125°C (TA)

Tray

A54SX72A

125 °C

-40 °C

2.5 V

1.5 ns

108000

217 MHz

6036

6036

STD

4024

2.75 V

2.25 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

85 °C

有

A42MX16-2VQG100I

117 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

215 MHz

有

90

Actel

3.3, 5 V

3 V

5.5 V

5.5 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2

2.1 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

5.29

Details

140 I/O

3 V

0 C

+ 70 C

SMD/SMT

198 MHz

有

24

Actel

5.25 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-1PQG208

108 MHz

FQFP

SQUARE

活跃

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P250-PQG208I

350 MHz

FQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.35

Details

3000 LE

151 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

24

36864 bit

ProASIC3

0.669609 oz

1.425 V

1.575 V

MSL 3 - 168 hours

1.575 V

Tray

A3P250

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

-40°C ~ 100°C (TJ)

Tray

A3P250

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

231 MHz

S-PQFP-G208

不合格

INDUSTRIAL

4.5 kB

4.5 kB

30 mA

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

3000

36Kbit

250000

231 MHz

STD

-

6144

6144

1.575 V

1.425 V

250000

3.4 mm

28 mm

28 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

70 °C

无

A3PE1500-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

0 to 70 °C

Tray

A3PE1500

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5/3.3 V

COMMERCIAL

33.8 kB

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

231 MHz

STD

38400

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

174 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.6

Details

72 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

192 MHz

有

16

Actel

0.239083 oz

5.25 V

Tray

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX09-PLG84A

-40°C ~ 125°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

AUTOMOTIVE

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

STD

2 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

Details

125 I/O

3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

24

Actel

0.196363 oz

Tray

A42MX24

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-1PQG160

96.6 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

5.25 V

Tray

A42MX36

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-3PQG208

100 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

180 MHz

1184

3

1822

1.9 ns

2438

5.25 V

3 V

54000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-1FGG144

350 MHz

LBGA

SQUARE

活跃

0°C ~ 85°C (TJ)

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

COMMERCIAL

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

1.575 V

1.425 V

400000

1.05 mm

13 mm

13 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

GRID ARRAY, LOW PROFILE

LBGA,

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

5.29

MICROSEMI CORP

活跃

SQUARE

LBGA

AFS1500-FGG256I

有

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

1.0989 GHz

S-PBGA-B256

不合格

INDUSTRIAL

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.0989 GHz

38400

1.575 V

1.425 V

1500000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

Details

104 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

269 MHz

有

40

Actel

5.5 V

Tray

A42MX09

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-2TQG176I

146 MHz

LFQFP

-40°C ~ 85°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

1.8 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

Details

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

188 MHz

有

27

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-3PLG44

109 MHz

QCCJ

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

1.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

85 °C

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

Details

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

160 MHz

有

66

Actel

0.062040 oz

Tray

A40MX02

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

5.29

MICROSEMI CORP

活跃

RECTANGULAR

QFP

92 MHz

A40MX02-1PQG100I

有

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2.3 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

418 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

40

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

AX1000-1FGG676I

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B676

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

微芯片技术

156 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

360 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

30

70 °C

无

A54SX72A-FFG484

0°C ~ 70°C (TA)

Tray

A54SX72A

e0

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

360

不合格

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

269 MHz

有

16

Actel

0.239083 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-2PLG84

146 MHz

QCCJ

0°C ~ 70°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.8 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

SQUARE

活跃

MICROSEMI CORP

CHIP CARRIER

ROHS COMPLIANT, PLASTIC, LCC-44

5.29

Details

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

27

Actel

0.084185 oz

5.5 V

Tray

A40MX04

活跃

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX04-2PLG44I

101 MHz

QCCJ

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

有

A54SX32A-1TQG100I

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

90

Actel

0.023175 oz

Tray

A54SX32

活跃

2.75 V

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

-40°C ~ 85°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,2.5/5 V

INDUSTRIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

SQUARE

活跃

MICROSEMI CORP

5.29

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

160 MHz

有

16

Actel

0.239083 oz

5.25 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-1PLG84

48 MHz

QCCJ

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

5.3

Details

140 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

237 MHz

有

40

Actel

5.5 V

Tray

A42MX16

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX16-3TQG176I

129 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.5 V

3 V

24000

1.4 mm

24 mm

24 mm

无

N/A

-

表面贴装

BGA-329

329-PBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

Details

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

-55°C ~ 125°C (TC)

Tray

A54SX32A

2.5 V

48000

2880

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

MICROSEMI CORP

5.29

Details

69 I/O

3 V

0 C

+ 70 C

SMD/SMT

160 MHz

有

90

Actel

Tray

A40MX04

活跃

5.25 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-1VQG80

48 MHz

TQFP

SQUARE

活跃

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.3 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

146 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

72 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

269 MHz

有

16

Actel

0.239083 oz

5.5 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-2PLG84I

-40°C ~ 85°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.8 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-68

YES

68

68-PLCC (24.23x24.23)

68

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

有

-

19

Actel

0.171777 oz

微芯片技术

3.3, 5 V

3 V

5.25 V

40MX

70C

Commercial

PLCC

3000

0C to 70C

57

3000

295

0.45UM

5.25(V)

3.3/5(V)

无

3(V)

0C

有

295

147

表面贴装

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

未说明

70 °C

有

A40MX02-FPLG68

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.37

Details

295 LE

57 I/O

0 to 70 °C

Tube

A40MX02

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

未说明

1.27 mm

compliant

50/83(MHz)

S-PQCC-J68

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

F

3.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm