N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

Details

有

60

Fusion

172

Tray

M1AFS600

活跃

This product may require additional documentation to export from the United States.

-55°C ~ 100°C (TJ)

Tray

M1AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

161

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

119

IGLOO2

1.26 V

活跃

M2GL005

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

Tray

M1A3P400

微芯片技术

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-1PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

24

ProASIC3

151

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CSP-281

YES

281

281-CSP (10x10)

281

1000000

1000000

微芯片技术

215

Tray

M1AGL1000

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

20

1.14 V

100 °C

无

M1AGL1000V2-CS281I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

SMD/SMT

有

184

IGLOOe

-40°C ~ 85°C (TA)

Tray

M1AGL1000V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

24576

1000000

10 mm

10 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

100 °C

有

M1AFS1500-1FGG256K

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

Details

有

90

Fusion

119

Tray

M1AFS1500

活跃

LBGA,

GRID ARRAY, LOW PROFILE

-55°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B256

不合格

OTHER

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1500000

17 mm

17 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-FCV484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

活跃

微芯片技术

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

有

M2GL150T-1FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

24

IGLOO2

574

Tray

M2GL150

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

有

M2GL050TS-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL050

e0

锡铅

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

1

56340

17 mm

17 mm

含铅

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

无

M2GL050TS-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050T-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005S-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

1.26 V

169

Tray

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

活跃

微芯片技术

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.2 V

20

1.14 V

100 °C

无

M2GL150T-1FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

574

Tray

M2GL150

-40°C ~ 100°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

INDUSTRIAL

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050T-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

1.2000 V

1.14 V

1.26 V

377

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

0 to 85 °C

Tray

M2GL050T

85 °C

0 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

574

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

活跃

微芯片技术

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050T-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

STD

56340

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

Tray

M2GL150

活跃

This product may require additional documentation to export from the United States.

N

有

-40 to 100 °C

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

STD

N/A

-

表面贴装

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

293

Tray

M2GL150

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL005

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005S-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

1.26 V

169

Tray

0°C ~ 85°C (TJ)

Tray

M2GL005S

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

活跃

微芯片技术

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050T-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

- 40 C

+ 100 C

SMD/SMT

有

微芯片技术

27

IGLOO2

1.26 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

有

M2GL050-FGG896I

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

56340 LE

377 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

667 Mb/s

377

2.44 mm

现场可编程门阵列

56340

1869824

8 Transceiver

56340

31 mm

31 mm