N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

A54SX32A-1FGG256

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

0 C

+ 70 C

SMD/SMT

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-PQG100

94 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

1.52

Details

608 LE

83 I/O

3 V

0°C ~ 70°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

-

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

STD

-

2.8 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

0°C ~ 70°C (TA)

Tray

M7AFS600

1.5 V

110592

600000

2

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Tin

表面贴装

表面贴装

PLCC-84

YES

84

84-PLCC (29.31x29.31)

6.777889 g

84

129 MHz

微芯片技术

有

-

16

Actel

0.239083 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-FPLG84

70 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.26

Details

336 LE

72 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

336

14000

129 MHz

336

516

3.5 ns

684

5.25 V

3 V

14000

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85

Tray

A42MX24

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX24-3PQG208

FQFP

SQUARE

活跃

MICROSEMI CORP

1.6

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

24

Actel

0°C ~ 70°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

3

1410

2 ns

1890

5.25 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 55 C

+ 125 C

SMD/SMT

有

微芯片技术

16

Actel

0.239083 oz

Tray

A42MX24

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX24-1PLG84M

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

72 I/O

3 V

-55°C ~ 125°C (TC)

Tube

A42MX24

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

MILITARY

1890 CLBS, 36000 GATES

4.572 mm

现场可编程门阵列

36000

2.1 ns

1890

36000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

- 40 C

+ 85 C

SMD/SMT

296 MHz

有

微芯片技术

16

Actel

0.239083 oz

5.5 V

Tray

A42MX09

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX09-3PLG84I

161 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

-40°C ~ 85°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

1.6 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS600-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

119 I/O

-40°C ~ 100°C (TJ)

Tray

M1AFS600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

2

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

A3P125

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-2FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-100

YES

100

100-PQFP (20x14)

1.758804 g

100

SMD/SMT

237 MHz

有

微芯片技术

66

Actel

0.062040 oz

3.3, 5 V

3 V

5.25 V

Tray

A42MX16

活跃

5.25 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX16-3PQG100

129 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.3

Details

83 I/O

3 V

0 C

+ 70 C

0 to 70 °C

Tray

A42MX16

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.25 V

3 V

24000

2.7 mm

20 mm

14 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P600-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

+ 125 C

SMD/SMT

180 MHz

微芯片技术

有

-

160

Actel

0.014110 oz

2.625 V

Tray

APA075

活跃

BGA, BGA144,12X12,40

网格排列

3

PLASTIC/EPOXY

BGA144,12X12,40

有

APA075-FGG144A

BGA

SQUARE

活跃

MICROSEMI CORP

5.61

Details

-

100 I/O

2.375 V

- 40 C

-40°C ~ 125°C (TJ)

Tray

APA075

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B144

100

不合格

2.5,2.5/3.3 V

100

现场可编程门阵列

27648

75000

STD

3072

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

Tray

A3PE600

活跃

1.575 V

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

40

70 °C

有

A3PE600-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

A3PE600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

165

不合格

1.5/3.3 V

COMMERCIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

11000 LE

300 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

231 MHz

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Actel

2.625 V

Tray

APA600

活跃

QFP, QFP208,1.2SQ,20

FLATPACK

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

有

APA600-PQG208A

QFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

-40°C ~ 125°C (TJ)

Tray

APA600

125 °C

-40 °C

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

15.8 kB

158

现场可编程门阵列

129024

600000

180 MHz

STD

21504

21504

2.625 V

2.375 V

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

101 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

24

Actel

0.196363 oz

5.5 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1PQG160M

135 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

MILITARY

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

有

A3PE1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0°C ~ 85°C (TJ)

Tray

A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

N

-

177 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

0 to 70 °C

Tray

A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

Details

295 LE

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

微芯片技术

有

295 LAB

19

Actel

0.171777 oz

5.25 V

3 V

3.3, 5 V

5.25 V

Tube

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-PLG68

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.54

0 to 70 °C

Tube

A40MX02

e3

Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

-

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

STD

-

2.7 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P125

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-2FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0 to 70 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

A3PE3000-FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

620 I/O

0 to 70 °C

Tray

A3PE3000

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

231 MHz

STD

75264

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

24

Actel

Tray

A42MX36

活跃

5.25 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-2PQG208

91 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

164 MHz

有

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

164 MHz

1184

2

1822

2.1 ns

2438

5.25 V

3 V

54000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

+ 85 C

- 40 C

1.425 V

71 I/O

Details

有

微芯片技术

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P060-2VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

310 MHz

-40 to 85 °C

Tray

A3P060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

2

1536

60000

1 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

Details

100 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.046530 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

A3P125

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-2TQG144I

350 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

2

3072

125000

1.4 mm

20 mm

20 mm