Kingston Technology HX316LS9IBK2/8

Lead Shape

No Lead

PCB changed

204

Package Length

67.6

Package Height

30

Mounting

Socket

Supplier Package

SODIMM

Standard Package Name

DIMM

SPD EEPROM Support

无

CAS Latency

9

Number of Chip Banks

8

Number of Ranks

Single

ECC Support

无

Module Sides

Double

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

0

Maximum Operating Supply Voltage (V)

1.45/1.575

Typical Operating Supply Voltage (V)

1.35/1.5

Minimum Operating Supply Voltage (V)

1.28/1.425

Chip Package Type

FBGA

Chip Configuration

512Mx8

Maximum Clock Rate (MHz)

1600

Data Bus Width (bit)

64

Chip Density (bit)

4G

Number of Chip per Module

16

Module Density

8Gbyte

Module

DRAM模块

HTS

8473.30.11.40

ECCN (US)

EAR99

零件状态

活跃

引脚数量

204

组织结构

512Mx64x2

锁相环

无

自我刷新

无

模块类型

204SODIMM

RoHS状态

是,有豁免