Kingston Technology KSM24RS4/16MEI

工厂交货时间

4 Weeks, 2 Days

表面安装

NO

终端数量

288

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

2Gx4

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

2160

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Single

CAS Latency

17

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

Package Description

DIMM,

Package Style

微电子组件

Number of Words Code

2000000000

Package Body Material

UNSPECIFIED

Operating Temperature-Max

85 °C

Manufacturer Part Number

KSM24RS4/16MEI

Number of Words

2147483648 words

Supply Voltage-Nom (Vsup)

1.2 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Kingston Technology Company

Part Life Cycle Code

生命周期结束

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.59

零件状态

Obsolete

技术

CMOS

端子位置

DUAL

终端形式

无铅

功能数量

1

Reach合规守则

unknown

引脚数量

288

JESD-30代码

R-XDMA-N288

温度等级

OTHER

端口的数量

1

操作模式

SYNCHRONOUS

组织结构

2Gx72

座位高度-最大

31.37 mm

内存宽度

72

记忆密度

154618822656 bit

内存IC类型

DDR内存模块

访问模式

多库页面突发

模块类型

288DIMM

长度

133.35 mm

RoHS状态

符合RoHS标准