Kingston Technology KSM24SES8/8ME

ECCN (US)

EAR99

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

9

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

1305

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Single

CAS Latency

17

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

3.7(Max)

PCB changed

260

零件状态

Obsolete

引脚数量

260

组织结构

1Gx72

模块类型

260SODIMM

RoHS状态

是,有豁免