Kingston Technology KSM26RD8/16HAI

ECCN (US)

EAR99

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

1Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

2010

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

ECC Support

有

Number of Ranks

Dual

CAS Latency

19

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

Package Description

,

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

KSM26RD8/16HAI

Manufacturer

Kingston Technology Company

Part Life Cycle Code

Obsolete

Ihs Manufacturer

KINGSTON TECHNOLOGY COMPANY INC

Risk Rank

5.83

零件状态

Obsolete

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

引脚数量

288

组织结构

2Gx72

内存IC类型

DDR内存模块

模块类型

288DIMM

RoHS状态

符合RoHS标准