Kingston Technology KSM26RD8/32MEI

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Number of Chip per Module

18

Chip Density (bit)

16G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

2Gx8

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Operating Current (mA)

1656

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

CAS Latency

19

SPD EEPROM Support

无

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

4Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准