Kingston Technology KVR13LR9D8L/4HC

ECCN (US)

EAR99

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

18

Chip Density (bit)

2G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

VLP RDIMM

Mounting

Socket

Package Height

18.75

Package Length

133.35

PCB changed

240

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

512Mx72

锁相环

有

自我刷新

无

模块类型

240RDIMM

RoHS状态

供应商未确认