Kingston Technology KVR16LS11/4BK

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.28/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

无

Number of Ranks

Single

CAS Latency

11

PC Type

PC3L-12800

SPD EEPROM Support

有

零件状态

活跃

组织结构

512Mx64

记忆密度

4

锁相环

无

自我刷新

有

模块类型

204SODIMM

RoHS状态

供应商未确认