Kingston Technology KVR21R15D4/16

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2133

Chip Configuration

1Gx4

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

15

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

Lead Shape

No Lead

Maximum Clock Rate

2133(MHz)

Operating Temperature (Max.)

85C

Total Density

16GByte(b)

Operating Temperature Classification

Commercial

Package Type

RDIMM

Operating Temp Range

0C to 85C

Number of Elements

36

Device Core Size

72(b)

Operating Supply Voltage (Max)

1.26(V)

Operating Supply Voltage (Typ)

1.2(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.14(V)

Operating Temperature (Min.)

0C

Main Category

DRAM模块

Schedule B

8473300002, 8473300002/8473300002/8473300002/8473300002/8473300002

RoHS

Non-Compliant

零件状态

Obsolete

引脚数量

288

组织结构

2Gx72

锁相环

无

自我刷新

无

模块类型

288RDIMM

RoHS状态

符合RoHS标准