Kingston Technology KVR26N19S6/4

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

4

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

2666

Chip Configuration

512Mx16

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

19

PC Type

PC4-2666

SPD EEPROM Support

有

Supplier Package

DIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

PCB changed

288

Pins

288

零件状态

活跃

引脚数量

288

电压

1.2V

速度

2666MHz

组织结构

512Mx64

记忆密度

4

电容量

4 GB

自我刷新

有

模块类型

288DIMM

RoHS状态

符合RoHS标准