Kingston Technology KVR32S22S6/4

Module Density

4Gbyte

Number of Chip per Module

4

Chip Density (bit)

8G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

3200

Chip Configuration

512Mx16

Chip Package Type

FBGA

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Single

ECC Support

无

Number of Ranks

Single

CAS Latency

22

PC Type

PC4-3200

SPD EEPROM Support

有

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

69.6

Package Width

2.45(Max)

PCB changed

260

Module

DRAM模块

ECCN (US)

EAR99

Pins

260

零件状态

活跃

引脚数量

260

电压

1.2V

速度

3200MHz

组织结构

512Mx64

电容量

4 GB

自我刷新

有

模块类型

260SODIMM

RoHS状态

符合RoHS标准