Kingston Technology KVR400X64SC3A/512

ECCN (US)

EAR99

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

8

Chip Density (bit)

512M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

400

Chip Configuration

32Mx16

Chip Package Type

TSOP

Minimum Operating Supply Voltage (V)

2.5

Typical Operating Supply Voltage (V)

2.6

Maximum Operating Supply Voltage (V)

2.7

Module Sides

Double

ECC Support

无

Number of Chip Banks

4

CAS Latency

3

SPD EEPROM Support

无

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

31.75

Package Length

67.6

Package Width

3.8(Max)

PCB changed

200

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

200

组织结构

64Mx64

锁相环

无

自我刷新

无

模块类型

200SODIMM

RoHS状态

供应商未确认