Microsemi W3E32M72S-266BM

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

5

Chip Density (bit)

460.8M

Data Bus Width (bit)

72

Max. Access Time (ns)

0.75

Maximum Clock Rate (MHz)

266

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.7

Operating Current (mA)

2000

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

ECC Support

有

Number of Chip Banks

4

CAS Latency

2.5

SPD EEPROM Support

无

Supplier Package

BGA

Mounting

表面贴装

Package Height

2.03(Max)

Package Length

32.1(Max)

Package Width

25.1(Max)

PCB changed

219

引脚数量

219

组织结构

32Mx72

锁相环

无

自我刷新

有

RoHS状态

供应商未确认