Microsemi WEDPN16M64V-100B2I

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

1Gbit

Number of Chip per Module

4

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

7|7|7|7|7|7|7|7|7|7|7|7|7|7

Maximum Clock Rate (MHz)

100

Chip Configuration

16Mx16

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

540

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Module Sides

Single

ECC Support

无

Number of Chip Banks

4

CAS Latency

3|2

SPD EEPROM Support

无

Supplier Package

PBGA

Mounting

表面贴装

Package Height

2.03(Max)

Package Length

21.1(Max)

Package Width

21.1(Max)

PCB changed

219

零件状态

Unconfirmed

引脚数量

219

组织结构

16Mx64

锁相环

无

刷新周期

8K

自我刷新

有

RoHS状态

供应商未确认