Microsemi WEDPN16M64V-133B2M

Number of Chip per Module

4

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

6|5.5

Maximum Clock Rate (MHz)

133

Chip Configuration

16Mx16

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

540

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

Module Sides

Single

ECC Support

无

Number of Chip Banks

4

CAS Latency

3|2

SPD EEPROM Support

无

Supplier Package

PBGA

Mounting

表面贴装

Package Height

2.03(Max)

Package Length

21.1(Max)

Package Width

21.1(Max)

PCB changed

219

Module Density

1Gbit

Module

DRAM模块

ECCN (US)

4A994.a

零件状态

Unconfirmed

引脚数量

219

组织结构

16Mx64

锁相环

无

刷新周期

8K

自我刷新

有

RoHS状态

供应商未确认