Microsemi WF128K32N-70H1M5

ECCN (US)

4A994.a

Module

闪存模块

Module Density

4Mbit

Number of Chip per Module

4

Chip Density (bit)

1M

Data Bus Width (bit)

32

Max. Access Time (ns)

70

Chip Configuration

128Kx8

Chip Package Type

HIP

PCB changed

66

Package Width

27.3

Package Length

27.3

Package Height

3.71(Max)

Mounting

通孔

Supplier Package

HIP

ECC Support

无

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Operating Current (mA)

140

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

4.5

零件状态

Obsolete

引脚数量

66

组织结构

128Kx32

自我刷新

无

RoHS状态

供应商未确认