Microsemi W3J512M72G-800PBI

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

9

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

800

Chip Configuration

512Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1260

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

无

Number of Ranks

Single

CAS Latency

6

SPD EEPROM Support

无

Supplier Package

BGA

Mounting

表面贴装

Package Height

5.5(Max)

Package Length

32.25(Max)

Package Width

23.25(Max)

PCB changed

543

零件状态

Obsolete

引脚数量

543

组织结构

512Mx72

锁相环

无

自我刷新

有

模块类型

SODIMM

RoHS状态

供应商未确认