Microsemi W3H128M72E-667SBM

Package Width

16.1(Max)

PCB changed

208

Package Length

22.1(Max)

Package Height

4.57(Max)

Mounting

表面贴装

Supplier Package

BGA

SPD EEPROM Support

无

CAS Latency

6

Number of Chip Banks

8

ECC Support

有

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Operating Current (mA)

1375

Maximum Operating Supply Voltage (V)

1.9

Typical Operating Supply Voltage (V)

1.8

Minimum Operating Supply Voltage (V)

1.7

Chip Package Type

PBGA

Maximum Clock Rate (MHz)

667

Max. Access Time (ns)

1.25

Data Bus Width (bit)

72

Chip Density (bit)

1.8G

Number of Chip per Module

5

Module Density

1Gbyte

Module

DRAM模块

ECCN (US)

4A994.a

零件状态

活跃

引脚数量

208

组织结构

128Mx72

锁相环

无

自我刷新

有

RoHS状态

供应商未确认