Microsemi W3H128M72E2-400NBI

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

5

Chip Density (bit)

1.8G

Data Bus Width (bit)

72

Max. Access Time (ns)

1.35

Maximum Clock Rate (MHz)

400

Chip Package Type

PBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

900

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

有

Number of Chip Banks

8

CAS Latency

4

SPD EEPROM Support

无

Supplier Package

BGA

Mounting

表面贴装

Package Height

3.94(Max)

Package Length

22.1(Max)

Package Width

16.1(Max)

PCB changed

208

引脚数量

208

组织结构

128Mx72

锁相环

无

自我刷新

有

RoHS状态

供应商未确认