W25M512JVEIMS详情
Winbond W25M512JVEIMS重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
触点镀层
Gold
Body Orientation
直角
Termination Method
压装
Base/Housing Material
Thermoplastic
Contact Materials
磷青铜
Mounting
通孔
Manufacturer
Winbond
Brand
Winbond
性别
Receptacle
子类别
Memory & Data Storage
螺距
2.0320 mm
产品类别
多芯片封装
产品类别
多芯片封装
产品长度
18.49 mm
W25M512JVEIMS拓展信息
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics








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