Winbond Electronics Corporation W63CH6MBVABE

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

Mobile LPDDR3 SDRAM

Chip Density (bit)

4G

Number of Internal Banks

8

Number of Words per Bank

32M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

800

Maximum Access Time (ns)

5.5

Address Bus Width (bit)

17

Interface Type

HSUL_12

Minimum Operating Supply Voltage (V)

1.7|1.14

Typical Operating Supply Voltage (V)

1.8|1.2

Maximum Operating Supply Voltage (V)

1.95|1.3

Operating Current (mA)

250

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.67

Package Width

11

Package Length

11.5

PCB changed

178

Supplier Package

VFBGA

Supply Voltage-Nom (Vsup)

1.8V / 1.2V

零件状态

Obsolete

类型

Low Power DDR3 SDRAM

引脚数量

178

速度

800/933MHz

组织结构

256Mx16

记忆密度

4Gb

温度

-25ºC~85ºC, -40ºC~85ºC