Winbond Electronics Corporation W948D2FBJX5E/TRAY

引脚数

90

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

无

PPAP

无

DRAM Type

移动 LPDDR SDRAM

Chip Density (bit)

256M

Number of Internal Banks

4

Number of Words per Bank

2M

Number of Bits/Word (bit)

32

Data Bus Width (bit)

32

Maximum Clock Rate (MHz)

200

Maximum Access Time (ns)

6.5|5

Address Bus Width (bit)

14

Interface Type

LVCMOS

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Operating Current (mA)

55

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Extended

Number of I/O Lines (bit)

32

Mounting

表面贴装

Package Height

0.66

Package Width

8

Package Length

13

PCB changed

90

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

Maximum Clock Rate

200(MHz)

Operating Temperature Classification

Commercial

Package Type

VFBGA

Operating Temp Range

-25C to 85C

Address Bus

14(b)

Operating Supply Voltage (Max)

1.95(V)

Operating Supply Voltage (Typ)

1.8(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.7(V)

零件状态

活跃

类型

移动 LPDDR SDRAM

组织结构

8Mx32

密度

268435456(Bit)

访问时间（最大）

6.5/5(ns)

供应电流

55(mA)