Winbond Electronics Corporation W956D6HBCX7I/TRAY

引脚数

54

EU RoHS

Compliant

ECCN (US)

3A991.b.2.a

Automotive

无

PPAP

无

Chip Density (bit)

64M

Number of Words

4M

Number of Bits/Word (bit)

16

Data Rate Architecture

SDR

Address Bus Width (bit)

16

Timing Type

Asynchronous|Synchronous

Max. Access Time (ns)

70

Maximum Clock Rate (MHz)

133

Process Technology

CMOS

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Operating Current (mA)

40

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

表面贴装

Package Height

0.66(Max)

Package Width

6

Package Length

8

PCB changed

54

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

零件状态

Obsolete

端口的数量

1