Winbond Electronics Corporation W967D6HBGX7I/TRAY

引脚数

54

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.02

Automotive

无

PPAP

无

Chip Density (bit)

128M

Number of Words

8M

Number of Bits/Word (bit)

16

Data Rate Architecture

SDR

Address Bus Width (bit)

23

Timing Type

Asynchronous|Synchronous

Maximum Access Time (ns)

70

Maximum Clock Rate (MHz)

133

Process Technology

65nm, CMOS

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Maximum Operating Supply Current (mA)

40

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

表面贴装

Package Height

0.66(Max)

Package Width

6

Package Length

8

PCB changed

54

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

零件状态

Obsolete

端口的数量

1