Winbond Electronics Corporation W978H6KBVX2I/TRAY

引脚数

134

Supplier Package

VFBGA

PCB changed

134

Package Length

11.5

Package Width

10

Package Height

0.58

Mounting

表面贴装

Number of I/O Lines (bit)

16

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Operating Current (mA)

175

Maximum Operating Supply Voltage (V)

1.95|1.3

Typical Operating Supply Voltage (V)

1.8|1.2

Minimum Operating Supply Voltage (V)

1.7|1.14

Interface Type

HSUL_12

Address Bus Width (bit)

15

Maximum Access Time (ns)

5.5

Maximum Clock Rate (MHz)

400

Data Bus Width (bit)

16

Number of Bits/Word (bit)

16

Number of Words per Bank

4M

Number of Internal Banks

4

Chip Density (bit)

256M

DRAM Type

Mobile LPDDR2 SDRAM

PPAP

无

Automotive

无

ECCN (US)

EAR99

EU RoHS

Compliant

零件状态

活跃

组织结构

16Mx16