Winbond Electronics Corporation W97BH2LBVX2E/TRAY
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W97BH2LBVX2E/TRAY
2736-W97BH2LBVX2E/TRAY
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W97BH2LBVX2E/TRAY datasheet pdf and Memory product details from Winbond Electronics Corporation stock available at utmel
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W97BH2LBVX2E/TRAY详情
Winbond Electronics Corporation W97BH2LBVX2E/TRAY重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
引脚数
134
EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
无
PPAP
无
DRAM Type
Mobile LPDDR2 SDRAM
Chip Density (bit)
2G
Number of Internal Banks
8
Number of Words per Bank
8M
Number of Bits/Word (bit)
32
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
400
Maximum Access Time (ns)
5.5
Address Bus Width (bit)
17
Interface Type
HSUL_12
Minimum Operating Supply Voltage (V)
1.7|1.14
Typical Operating Supply Voltage (V)
1.8|1.2
Maximum Operating Supply Voltage (V)
1.95|1.3
Operating Current (mA)
190
Minimum Operating Temperature (°C)
-25
Maximum Operating Temperature (°C)
85
Number of I/O Lines (bit)
32
Mounting
表面贴装
Package Height
0.58
Package Width
10
Package Length
11.5
PCB changed
134
Supplier Package
VFBGA
零件状态
Unconfirmed
组织结构
64Mx32
W97BH2LBVX2E/TRAY拓展信息
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics
Winbond Electronics







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