Winbond Electronics Corporation W97BH6LBVX2E

Interface Type

HSUL_12

Address Bus Width (bit)

17

Maximum Access Time (ns)

5.5

Maximum Clock Rate (MHz)

400

Data Bus Width (bit)

16

Number of Bits/Word (bit)

16

Number of Words per Bank

16M

Number of Internal Banks

8

Chip Density (bit)

2G

DRAM Type

Mobile LPDDR2 SDRAM

PPAP

无

Automotive

无

HTS

8542.32.00.36

ECCN (US)

EAR99

EU RoHS

Compliant

Supplier Package

VFBGA

PCB changed

134

Package Length

11.5

Package Width

10

Package Height

0.58

Mounting

表面贴装

Number of I/O Lines (bit)

16

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-25

Operating Current (mA)

190

Maximum Operating Supply Voltage (V)

1.3|1.95

Typical Operating Supply Voltage (V)

1.2|1.8

Minimum Operating Supply Voltage (V)

1.14|1.7

零件状态

NRND

引脚数量

134

组织结构

128Mx16