Winbond Electronics Corporation W97BH6LBVX2E TR

引脚数

134

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.36

DRAM Type

Mobile LPDDR2 SDRAM

Chip Density (bit)

2G

Number of Internal Banks

8

Number of Words per Bank

16M

Number of Bits/Word (bit)

16

Data Bus Width (bit)

16

Maximum Clock Rate (MHz)

400

Maximum Access Time (ns)

5.5

Address Bus Width (bit)

17

Interface Type

HSUL_12

Minimum Operating Supply Voltage (V)

1.14|1.7

Typical Operating Supply Voltage (V)

1.2|1.8

Maximum Operating Supply Voltage (V)

1.3|1.95

Operating Current (mA)

190

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Number of I/O Lines (bit)

16

Mounting

表面贴装

Package Height

0.58

Package Width

10

Package Length

11.5

PCB changed

134

Supplier Package

VFBGA

零件状态

NRND

组织结构

128Mx16