Microchip的FPGA 评估板_正品采购_价格信息

品牌是'Microchip' (371)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	底架	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	质量	终端数量														厂商																																															操作温度	包装	系列	JESD-609代码	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	最大电源电压	最小电源电压	工作电源电流	内存大小	传播延迟	接通延迟时间
AX2000-1FG1152M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	表面贴装	1152-BGA	YES	1152	1152-FPBGA (35x35)	400.011771 mg	1152	微芯片技术	763 MHz	3	125 °C	-55 °C	PLASTIC/EPOXY	BGA	BGA1152,34X34,40	SQUARE	网格排列	1.575 V	1.5 V	20	684	Tray	AX2000	活跃	Compliant	1.425 V	Military grade	AX2000-1FG1152M	无	活跃	MICROSEMI CORP	BGA, BGA1152,34X34,40	5.29	ic	-55°C ~ 125°C (TA)		Axcelerator	e0	3A001.A.2.C	TIN LEAD/TIN LEAD SILVER	125 °C	-55 °C	2000000 SYSTEM GATES AVAILABLE	8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	unknown			S-PBGA-B1152	684	不合格	1.5 V	1.5,1.5/3.3,2.5/3.3 V	MILITARY	1.575 V	1.425 V		36 kB	850 ps			684	21504 CLBS, 2000000 GATES	2.44 mm	现场可编程门阵列	21504		294912	2000000	763 MHz	32256	MIL-STD-883 Class B		1		21504	0.84 ns	21504	32256	2000000		1.73 mm	35 mm	35 mm	无
AGL400V5-CSG196	Microchip	数据表	20 In Stock	1: ¥503.760972 10: ¥475.246198 100: ¥448.345469 500: ¥422.967425 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	196-TFBGA, CSBGA	YES	196-CSP (8x8)	196	微芯片技术	TFBGA	PLASTIC/EPOXY	85 °C	3	5.25	TFBGA,	MICROSEMI CORP	活跃	有	AGL400V5-CSG196	1.5000 V	1.425 V	1.575 V	143	Tray	AGL400	活跃	1.425 V					1.575 V	1.5 V	未说明	GRID ARRAY, THIN PROFILE, FINE PITCH	SQUARE	0 to 70 °C		IGLOO							8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	未说明	0.5 mm	compliant			S-PBGA-B196		不合格			OTHER									9216 CLBS, 400000 GATES	1.2 mm	现场可编程门阵列	9216		55296	400000					STD				9216		400000			8 mm	8 mm
APA1000-FGG1152	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	1152-BGA	YES	1152-FPBGA (35x35)	1152	微芯片技术	PLASTIC/EPOXY	70 °C	3	180 MHz	5.26	BGA, BGA1152,34X34,40	MICROSEMI CORP	活跃	有	APA1000-FGG1152	712	Tray	APA1000	活跃	2.3 V					40	2.5 V	2.7 V	网格排列	SQUARE	BGA1152,34X34,40	BGA	0°C ~ 70°C (TA)		ProASICPLUS	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		2.3V ~ 2.7V	BOTTOM	BALL	245	1 mm	compliant			S-PBGA-B1152	712	不合格		2.5,2.5/3.3 V	COMMERCIAL								712	1000000 GATES	2.44 mm	现场可编程门阵列			202752	1000000										56320	1000000			35 mm	35 mm
A54SX08-1FGG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	表面贴装	144-LBGA	YES	144	144-FPBGA (13x13)	400.011771 mg	144	微芯片技术	SQUARE	GRID ARRAY, LOW PROFILE	3.6 V	3.3 V	40	A54SX08-1FGG144	有	活跃	MICROSEMI CORP	1 MM PITCH, ROHS COMPLIANT, FBGA-144	5.24	280 MHz	3.3, 5 V	2.97, 4.75 V	3.63, 5.25 V	111	Tray	A54SX08	活跃	Compliant	3 V		3	70 °C	PLASTIC/EPOXY	LBGA	BGA144,12X12,40	0 to 70 °C		SX	e1		Tin/Silver/Copper (Sn/Ag/Cu)	70 °C	0 °C	CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE	8542.39.00.01		3V ~ 3.6V, 4.75V ~ 5.25V	BOTTOM	BALL	260	1 mm	compliant	280 MHz		S-PBGA-B144	111	不合格	5 V	3.3,5 V	COMMERCIAL	5.25 V	4.75 V			800 ps	800 ps		111	768 CLBS, 8000 GATES	1.55 mm	现场可编程门阵列	768			12000	280 MHz	768		768	1		256	0.8 ns	768	768	8000		1.05 mm	13 mm	13 mm	无
A3P1000-FGG144T	Microchip	数据表	2552 In Stock	1: ¥2,133.463277 10: ¥2,012.701202 100: ¥1,898.774719 500: ¥1,791.296909 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	144-LBGA	YES	144-FPBGA (13x13)	144	微芯片技术	LBGA	BGA144,12X12,40	SQUARE	GRID ARRAY, LOW PROFILE	1.575 V	1.425 V	1.5 V	30	A3P1000-FGG144T	有	活跃	MICROSEMI CORP	LBGA, BGA144,12X12,40	5.23	350 MHz	3	97	Tray	A3P1000	活跃	Automotive grade					125 °C	-40 °C	PLASTIC/EPOXY	-40°C ~ 125°C (TA)		Automotive, AEC-Q100, ProASIC3	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	260	1 mm	compliant			S-PBGA-B144	97	不合格		1.5/3.3 V	AUTOMOTIVE								97	24576 CLBS, 1000000 GATES	1.55 mm	现场可编程门阵列			147456	1000000			AEC-Q100		STD				24576	24576	1000000			13 mm	13 mm
A3P600L-1FG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	表面贴装	YES	256	400.011771 mg	256	PLASTIC/EPOXY	BGA	BGA256,16X16,40		SQUARE	网格排列	1.575 V	1.2 V	30	177	Compliant	1.14 V				A3P600L-1FG256I	无	Obsolete	MICROSEMI CORP	BGA, BGA256,16X16,40	5.27	350 MHz	3	85 °C	-40 °C						TIN LEAD/TIN LEAD SILVER	85 °C	-40 °C		8542.39.00.01			BOTTOM	BALL	225	1 mm	compliant			S-PBGA-B256	177	不合格	1.2 V	1.5/3.3 V	INDUSTRIAL	1.26 V	1.14 V	5 mA	13.5 kB				177	13824 CLBS, 600000 GATES	1.8 mm	现场可编程门阵列				600000	892.86 MHz				1		13824		13824	13824	600000		1.2 mm	17 mm	17 mm	无
AGL400V2-FG256I	Microchip	数据表	2415 In Stock	1: ¥846.656875 10: ¥798.732901 100: ¥753.521605 500: ¥710.869442 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	256-LBGA	YES	256-FPBGA (17x17)	256	微芯片技术	MICROSEMI CORP	BGA,	5.28	3	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.575 V	1.2 V	30	1.2, 1.5 V	1.14 V	1.575 V	178	Tray	AGL400	活跃	1.14 V					AGL400V2-FG256I	无	活跃	-40 to 85 °C		IGLOO	e0	3A001.A.7.A	Tin/Lead/Silver (Sn/Pb/Ag)				8542.39.00.01		1.14V ~ 1.575V	BOTTOM	BALL	230	1 mm	unknown			S-PBGA-B256		不合格			INDUSTRIAL									9216 CLBS, 400000 GATES	1.8 mm	现场可编程门阵列	9216		55296	400000					STD				9216		400000			17 mm	17 mm
A54SX32A-1FG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	70 °C	PLASTIC/EPOXY	LBGA	BGA144,12X12,40	SQUARE		GRID ARRAY, LOW PROFILE	2.75 V	2.5 V	30	2.25 V								A54SX32A-1FG144	无	Obsolete	MICROSEMI CORP	1 MM PITCH, FBGA-144	5.32	278 MHz	3				e0		Tin/Lead/Silver (Sn/Pb/Ag)			32000 TYPICAL GATES AVAILABLE	8542.39.00.01			BOTTOM	BALL	225	1 mm	unknown			S-PBGA-B144	111	不合格		2.5,2.5/5 V	COMMERCIAL								111	2880 CLBS, 48000 GATES	1.55 mm	现场可编程门阵列												1.1 ns	2880	2880	48000			13 mm	13 mm
A3P250-FGG144I	Microchip	数据表	41 In Stock	1: ¥153.173205 10: ¥144.503020 100: ¥136.323608 500: ¥128.607178 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	FBGA-144	YES	144-FPBGA (13x13)	144	微芯片技术	36864 bit	97 I/O	+ 100 C	0.108878 oz	- 40 C	160	SMD/SMT	Microchip Technology / Atmel	350 MHz	ProASIC3	Details	Tray	A3P250	活跃	1.425 V					A3P250-FGG144I	有	活跃	MICROSEMI CORP	13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144	1.3	350 MHz	3	100 °C	-40 °C	PLASTIC/EPOXY	LBGA	SQUARE	GRID ARRAY, LOW PROFILE	1.575 V	1.5 V	40	MSL 3 - 168 hours	有	3000 LE	-40°C ~ 100°C (TJ)	Tray	A3P250	e1	3A001.A.7.B	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	可编程逻辑集成电路	1.425V ~ 1.575V	BOTTOM	BALL	260	1 mm	compliant			S-PBGA-B144		不合格	1.5 V		INDUSTRIAL			30 mA				-		6144 CLBS, 250000 GATES	1.55 mm	现场可编程门阵列		FPGA - Field Programmable Gate Array	36Kbit	250000					STD	-			6144		250000	FPGA - Field Programmable Gate Array	1.05 mm	13 mm	13 mm
AGL400V2-FG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	1.575 V		1.2 V	30	1.14 V								AGL400V2-FG144	无	Obsolete	MICROSEMI CORP	13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144	5.9	3	85 °C	PLASTIC/EPOXY	LBGA	SQUARE	GRID ARRAY, LOW PROFILE				e0		Tin/Lead/Silver (Sn/Pb/Ag)				8542.39.00.01			BOTTOM	BALL	230	1 mm	unknown			S-PBGA-B144		不合格			OTHER									9216 CLBS, 400000 GATES	1.55 mm	现场可编程门阵列													9216		400000			13 mm	13 mm
AGL600V5-FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	70 °C	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE		网格排列	1.575 V	1.5 V	30	1.425 V								AGL600V5-FG484	无	Transferred	ACTEL CORP	23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484	5.84	108 MHz	3				e0		锡铅银							BOTTOM	BALL	230	1 mm	compliant			S-PBGA-B484	235	不合格		1.5 V	COMMERCIAL								235	13824 CLBS, 600000 GATES	2.44 mm	现场可编程门阵列													13824	13824	600000			23 mm	23 mm
AX250-1FGG256M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	256-LBGA	YES	256-FPBGA (17x17)	256	微芯片技术	3	763 MHz	5.3	LBGA, BGA256,16X16,40	MICROSEMI CORP	活跃	有	AX250-1FGG256M	LBGA	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	1.575 V	1.5 V	40	138	Tray	AX250	活跃	1.425 V	Military grade					PLASTIC/EPOXY	-55 °C	125 °C	-55°C ~ 125°C (TA)		Axcelerator	e1	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)			250000 SYSTEM GATES AVAILABLE	8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	260	1 mm	compliant			S-PBGA-B256	248	不合格		1.5,1.5/3.3,2.5/3.3 V	MILITARY								248	2816 CLBS, 250000 GATES	1.7 mm	现场可编程门阵列			55296	250000		4224	MIL-STD-883 Class B					0.84 ns	2816	4224	250000			17 mm	17 mm
A3P400-FGG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	85C	Commercial	FBGA	400000	0C to 85C	194	400000	130NM	1.575(V)	1.5(V)	无	1.425(V)	0C	有	9216	表面贴装	1.425 V								A3P400-FGG484	有	Obsolete	MICROSEMI CORP	BGA,	7.56	350 MHz	3	85 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列		1.575 V	1.5 V	40	ProASIC®3		Tray		e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			BOTTOM	BALL	250	1 mm	compliant	231(MHz)	484	S-PBGA-B484		不合格			COMMERCIAL									9216 CLBS, 400000 GATES	2.44 mm	现场可编程门阵列													9216		400000			23 mm	23 mm
A14V100A-RQ208C	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH		3.6 V	3.3 V	20	3 V								A14V100A-RQ208C	无	Obsolete	MICROSEMI CORP	PLASTIC, RQFP-208	5.88	75 MHz	4	70 °C	PLASTIC/EPOXY				e0		锡铅			MAX 175 I/OS	8542.39.00.01			QUAD	鸥翼	225	0.5 mm	compliant			S-PQFP-G208		不合格			COMMERCIAL									1377 CLBS, 10000 GATES	4.1 mm	现场可编程门阵列												3.9 ns	1377		10000			28 mm	28 mm
A1020B-1CQ84C	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	YES	84	84	Non-Compliant						A1020B-1CQ84C	无	Obsolete	MICROSEMI CORP	5.81	53 MHz	70 °C	CERAMIC	GQFF	TPAK84,1.63SQ,25	SQUARE	FLATPACK, GUARD RING	5 V		8542390000/8542390000/8542390000/8542390000/8542390000	69							70 °C	0 °C		8542.39.00.01			QUAD	FLAT		0.635 mm	unknown	57 MHz		S-XQFP-F84	69	不合格	5 V	5 V	COMMERCIAL	5.25 V	4.75 V			3.8 ns			69			现场可编程门阵列	547			2000				547	1		273			547
A1280A-CQ172M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	172	-55 °C	CERAMIC, METAL-SEALED COFIRED	GQFF	TPAK172,2.5SQ,25	SQUARE		FLATPACK	5.5 V	5 V	30	4.5 V								A1280A-CQ172M	无	Transferred	ACTEL CORP	CERAMIC, CQFP-172	5.84	41 MHz	125 °C				e0		Tin/Lead (Sn/Pb)			MAX 140 I/OS				QUAD	FLAT	225	0.635 mm	compliant			S-CQFP-F172	140	不合格		5 V	MILITARY								140	1232 CLBS, 8000 GATES	2.9464 mm	现场可编程门阵列												5 ns	1232	1232	8000			29.972 mm	29.972 mm
A1280A-PL84I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	QCCJ	SQUARE	CHIP CARRIER		5.5 V	5 V	30	4.5 V								A1280A-PL84I	无	Obsolete	MICROSEMI CORP	PLASTIC, MS-007-AE, LCC-84	8.19	3	85 °C	-40 °C	PLASTIC/EPOXY				e0	EAR99	锡铅			MAX 72 I/OS	8542.39.00.01			QUAD	J BEND	225	1.27 mm	unknown			S-PQCC-J84		不合格			INDUSTRIAL									1232 CLBS, 8000 GATES	4.45 mm	现场可编程门阵列												5 ns	1232		8000			29.21 mm	29.21 mm
AGLN060V2-ZVQG100	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	100-TQFP	YES	100-VQFP (14x14)	100	微芯片技术	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	1.575 V	1.2 V	未说明	71	Tray	AGLN060	活跃	1.14 V					AGLN060V2-ZVQG100	有	不推荐	MICROSEMI CORP	TFQFP,	5.6	3	70 °C	-20 °C	-20°C ~ 85°C (TJ)		IGLOO nano	e3		Tin (Sn)				8542.39.00.01		1.14V ~ 1.575V	QUAD	鸥翼	未说明	0.5 mm	compliant			S-PQFP-G100		不合格			OTHER									1536 CLBS, 60000 GATES	1.2 mm	现场可编程门阵列	1536		18432	60000					STD				1536		60000			14 mm	14 mm
A3PN125-ZVQ100I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	100-TQFP	YES	100-VQFP (14x14)	100	微芯片技术	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	TQFP100,.63SQ	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	1.575 V	1.5 V	30	71	Tray	A3PN125	Obsolete	1.425 V					A3PN125-ZVQ100I	无	Obsolete	MICROSEMI CORP	TFQFP, TQFP100,.63SQ	5.32	3	-40°C ~ 100°C (TJ)		ProASIC3 nano	e0		Tin/Lead (Sn/Pb)				8542.39.00.01		1.425V ~ 1.575V	QUAD	鸥翼	225	0.5 mm	compliant			S-PQFP-G100	71	不合格		1.5,1.5/3.3 V	INDUSTRIAL								71	3072 CLBS, 125000 GATES	1.2 mm	现场可编程门阵列			36864	125000									3072	3072	125000			14 mm	14 mm
AGLN125V2-ZVQG100	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	100-TQFP	YES	100-VQFP (14x14)	100	微芯片技术	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	1.575 V	1.2 V	未说明	71	Tray	AGLN125	活跃	1.14 V					AGLN125V2-ZVQG100	有	不推荐	MICROSEMI CORP	TFQFP,	5.6	3	70 °C	-20 °C	-20°C ~ 85°C (TJ)		IGLOO nano	e3		Tin (Sn)				8542.39.00.01		1.14V ~ 1.575V	QUAD	鸥翼	未说明	0.5 mm	compliant			S-PQFP-G100		不合格			OTHER									3072 CLBS, 125000 GATES	1.2 mm	现场可编程门阵列	3072		36864	125000					STD				3072		125000			14 mm	14 mm
A1415A-VQG100M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	FLATPACK, THIN PROFILE, FINE PITCH		5.5 V	5 V	4.5 V								A1415A-VQG100M	有	Obsolete	MICROSEMI CORP	1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100	5.8	125 MHz	125 °C	-55 °C	PLASTIC/EPOXY	TFQFP	SQUARE					3A001.A.2.C					8542.39.00.01			QUAD	鸥翼		0.5 mm	compliant			S-PQFP-G100					MILITARY									200 CLBS, 1500 GATES	1.2 mm	现场可编程门阵列												3 ns	200		1500			14 mm	14 mm
AGLN060V2-ZCSG81	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	81-WFBGA, CSBGA	YES	81-CSP (5x5)	81	微芯片技术	MICROSEMI CORP	Obsolete	有	AGLN060V2-ZCSG81	60	Tray	AGLN060	Obsolete	1.14 V					-20 °C	PLASTIC/EPOXY	VFBGA	SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.575 V	1.2 V	未说明	70 °C	5.81	5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81	-20°C ~ 85°C (TJ)		IGLOO nano							8542.39.00.01		1.14V ~ 1.575V	BOTTOM	BALL	未说明	0.5 mm	compliant			S-PBGA-B81		不合格			OTHER									1536 CLBS, 60000 GATES	0.8 mm	现场可编程门阵列	1536		18432	60000									1536		60000			5 mm	5 mm
AGL400V2-FGG144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	8.61	LBGA,	MICROSEMI CORP		Obsolete	有	AGL400V2-FGG144I	1.14 V								1.575 V	1.2 V	40	GRID ARRAY, LOW PROFILE	SQUARE	LBGA	PLASTIC/EPOXY	-40 °C	100 °C	3				e1		锡银铜				8542.39.00.01			BOTTOM	BALL	260	1 mm	compliant			S-PBGA-B144		不合格			INDUSTRIAL									9216 CLBS, 400000 GATES	1.55 mm	现场可编程门阵列													9216		400000			13 mm	13 mm
AGL1000V5-CSG281	Microchip	数据表	2492 In Stock	1: ¥1,343.015003 10: ¥1,266.995285 100: ¥1,195.278574 500: ¥1,127.621292 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	281-TFBGA, CSBGA	YES	281-CSP (10x10)	281	微芯片技术	GRID ARRAY, THIN PROFILE, FINE PITCH	SQUARE	TFBGA	PLASTIC/EPOXY	85 °C	3	108 MHz	5.26	TFBGA,	MICROSEMI CORP	活跃	有	AGL1000V5-CSG281	1.5000 V	1.425 V	1.575 V	215	Tray	AGL1000	活跃	1.425 V					未说明	1.5 V	1.575 V	0 to 70 °C		IGLOO							8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	未说明	0.5 mm	compliant		281	S-PBGA-B281		不合格			OTHER									24576 CLBS, 1000000 GATES	1.05 mm	现场可编程门阵列	24576		147456	1000000					STD				24576		1000000			10 mm	10 mm
A54SX16A-1FG144M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	263 MHz	3	125 °C	-55 °C	PLASTIC/EPOXY	LBGA	BGA144,12X12,40		SQUARE	GRID ARRAY, LOW PROFILE	2.75 V	2.5 V	30	2.25 V								A54SX16A-1FG144M	无	Obsolete	MICROSEMI CORP	LBGA, BGA144,12X12,40	5.31				e0	3A001.A.2.C	Tin/Lead/Silver (Sn/Pb/Ag)			16000 TYPICAL GATES AVAILABLE	8542.39.00.01			BOTTOM	BALL	225	1 mm	compliant			S-PBGA-B144	111	不合格		2.5,2.5/5 V	MILITARY								111	1452 CLBS, 24000 GATES	1.55 mm	现场可编程门阵列												1.2 ns	1452	1452	24000			13 mm	13 mm

AX2000-1FG1152M

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGL400V5-CSG196

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

503.760972
APA1000-FGG1152

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A54SX08-1FGG144

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A3P1000-FGG144T

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

2,133.463277
A3P600L-1FG256I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGL400V2-FG256I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

846.656875
A54SX32A-1FG144

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A3P250-FGG144I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

153.173205
AGL400V2-FG144

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGL600V5-FG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AX250-1FGG256M

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A3P400-FGG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A14V100A-RQ208C

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A1020B-1CQ84C

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A1280A-CQ172M

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A1280A-PL84I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGLN060V2-ZVQG100

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A3PN125-ZVQ100I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGLN125V2-ZVQG100

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
A1415A-VQG100M

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGLN060V2-ZCSG81

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGL400V2-FGG144I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
AGL1000V5-CSG281

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)

1,343.015003
A54SX16A-1FG144M

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)